TG100™ is recommended for high-temperature heat transfer in
normal applications. It is used between heat generating
devices and the surfaces to which they are mounted or other
heat dissipating surfaces. This product delivers excellent
thermal resistance, offers high thermal conductivity and
virtually no evaporation over a wide operating temperature
range. It is nonflammable, oxidation resistant and does not
promote rust or corrosion.
TYPICAL PROPERTIES
Viscosity, Cone & Plate, mPa∙s (cP):
Temperature: 25 °C, Shear Rate: 0.5 s
-1
350,000
Specific Gravity @ 25 °C 1.94
Thermal Conductivity, W/mk 3.4
Thermal Impedance ASTM-D-5470, °C.in²/W:
80psi 0.017
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
DIRECTIONS FOR USE
1. For best results parts to be covered should be clean and
free of oil and debris.
2. Apply appropriate material to substrate so that there is
enough material to cover 100% of the surface between
the component and the heat sink and the material leaves
a small fillet.
3. Place the heat sink on top of the component and secure
with clips, screws or other hardware.